The ratings of 16 Oil and Gas stocks are down this week, according to the Portfolio Grader database. Each of these rates a “D” (“sell”) or “F” overall (“strong sell”).
Top Paper Stocks To Invest In 2015: Intermolecular Inc (IMI)
Intermolecular, Inc. (Intermolecular), incorporated on June 16, 2004, is engaged in research and development and time-to-market for the semiconductor and clean-energy industries. The Company, through paid collaborative development programs (CDPs) with its customers, develops technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. The Company provides its customers with technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. Through paid CDPs and its own development, the Company has established a portfolio of greater than 1,000 patents and patent applications. Its approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass coatings and glass-based devices, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy efficiency applications.
As of December 31, 2012, the Company targets large, high-volume semiconductor and high-growth emerging clean energy markets, including DRAM, non-volatile memory (including flash memory and embedded memory), complex logic, flat glass coatings and glass-based devices, solar cells, LEDs and other energy efficiency applications. The Company�� customers include ATMI, Inc. (ATMI), Elpida Memory, Inc. (Elpida), First Solar. Inc. (First), GLOBALFOUNDRIES Singapore Pte. Ltd (GLOBALFOUNDRIES), Guardian Industries Corp. (Guardian), SanDisk Corporation (SanDisk), Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba Corporation (Toshiba). For the year ended December 31, 2012, the Company has received the majority of its revenue from customers in DRAM, flash memory, complex logic and energy-efficient applications in flat glass. The elements in HPC platform include Tempus HPC processing, automated characterization, and informatics and analysis software. Tempus HPC processing are used to process ! different experiments consisting of combinations of materials, processing parameters, sequencing and device structures. Automated characterization systems are used to characterize the substrates processed by its Tempus HPC processing tools. Informatics and analysis software are used to automate experiment generation, characterization, data analysis and reporting.
The Company�� HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. The Company�� platform is purpose-built for Research and Development (R and D) using combinatorial process systems. Combinatorial processing is a methodology for discovery and development that employs parallel and other high-throughput experimentation, which allows R and D experimentation to be performed at speeds up to 100 times faster than traditional methods. The Company�� processing tools allows performing up to 192 experiments on a single substrate.
Advisors' Opinion:- [By Jake L'Ecuyer]
Leading and Lagging Sectors
Technology shares gained about 0.68 percent in today's trading. Meanwhile, top gainers in the sector included Intermolecular (NASDAQ: IMI), up 38.3 percent, and Infinera (NASDAQ: INFN), up 9.4 percent. In trading on Monday, utilities shares were relative laggards, down on the day by about 0.68 percent. - [By Sofia Horta e Costa]
ARM Holdings Plc (ARM) lost 2.6 percent, leading European technology companies lower before it publishes half-year results next week. IMI Plc (IMI) gained 2 percent as Citigroup Inc. listed the engineering company among its most preferred stocks.
- [By Jake L'Ecuyer]
Leading and Lagging Sectors
Technology shares gained about 0.68 percent in today's trading. Meanwhile, top gainers in the sector included Intermolecular (NASDAQ: IMI), up 38.3 percent, and Infinera (NASDAQ: INFN), up 9.4 percent. In trading on Monday, utilities shares were relative laggards, down on the day by about 0.68 percent. - [By Lisa Levin]
Intermolecular (NASDAQ: IMI) shares touched a new 52-week low of $4.84. Intermolecular shares have dropped 45.09% over the past 52 weeks, while the S&P 500 index has gained 26.39% in the same period.
Top 5 Semiconductor Stocks To Buy For 2014: GigOptix Inc (GIG)
GigOptix, Inc. (GigOptix), incorporated on March 2008, is a supplier of semiconductor and electro-optical component products that enables high-speed end to end data streaming over optical fiber and wireless telecommunications and data-communications networks globally. The Company's products convert signals between electrical and optical formats for transmitting and receiving data over fiber optic networks and between electrical and high speed radio frequencies to enable the transmission and receipt of data over wireless networks. The Company is creating both optical telecommunications and data-communications applications for fast growing markets in 10 giga bytes per second (Gbps), 40Gbps and 100Gbps drivers, receiver integrated circuits (IC), electro-optic modulator components and multi-chip-modules (MCM), as well as E-band wireless data-communications applications for high speed mobile backhaul and other high capacity wireless data transport applications. During the year ended December 31, 2011, the Company shipped over 150 products to over 200 customers.
The Company offers a portfolio of 10Gbps and 40Gbps electro-optical products and is developing market for 100Gbps products. The Company provides bundled solutions that consist of a few of its products, such as modulator and driver. The Company also offers a comprehensive portfolio of Monolithic Microwave Integrated Circuit (MMIC) and application-specific integrated circuit (ASIC) products to support E-band wireless communication and defense markets. The Company has also developed 10Gbps vertical cavity surface-emitting laser (VCSEL) drivers and receivers for aerospace as well as outdoor, non-temperature controlled environments that enables higher capacity in its customers' next generation flight and data center systems.
The Company has a portfolio of products for telecommunications , data-communications, defenses and industrial applications designed for optical speeds from 3Gbps to over 100Gbps and for wireless frequencies! from zero giga hertz (GHz) to 86GHz. The Company's products support a range of data rates, protocols, transmission distances and industry standards.
The Company's portfolio consists of the product ranges, such as laser and modulator drivers for 10Gbps, 40Gbps and 100Gbps applications; receiver amplifiers or Trans-impedance Amplifiers (TIAs) for 10Gbps, 40Gbps and 100Gbps applications; VCSEL driver and receiver chipsets for 14 and 12 channel parallel optics applications from 3Gbps to 10Gbps; Electro-optic modulators based on the Company's TFPS technology suitable for various 40Gbps and 100Gbps modulation schemes, such as differential phase shift keying (DPSK), differential quadrature phase shift keying (DQPSK), RZ-DQPSK and DP-QPSK; wideband monolithic microwave integrated circuit (MMIC) amplifiers with flat gain response; high frequency MMIC Power Amplifiers with high gain and output power; high frequency passive attenuators and filters in small form factors, and standard cell, and structured ASIC and hybrid ASIC designs and manufacturing service for multiple markets offering information technology acquisition review (ITAR) compliance for defense applications. The Company designs and market products that amplifies electrical signals during both the transmission (amplifiers and optical drivers) and reception (TIAs) of optical signals as well as modulate optical signals in the transmission of data.
The Company's optical drivers amplify the input digital data stream that is used to modulate laser light either by direct modulation of the laser or by use of an external modulator that acts as a precise shutter to switch on and off light to create the optical data stream. The Company supplies an optimized component for each type of laser, modulator and photo-diode depending upon the speed, reach and required cost. The Company's microwave and millimeter wave amplifiers amplify small signal radio signals into more signals that can be transmitted over long distances to establish high t! hroughput! data connections or enable radar based applications. The Company's ASIC solutions are used in a number of applications such as defense and test and measurement applications to enable the high speed processing of complex signals.
The Company's product portfolio is designed to cover the range of solutions needed in these different modules. The Company's product portfolio consists of five product lines: GX Series, which includes serial drivers and TIA ICs devices for telecom and data-com markets; HX Series, which includes multi-channel driver and TIA ICs for short reach data-com and optical interconnect applications; LX Series, which includes TFPS modulators for high speed telecom and defense applications; EX Series, which includes amplifiers, filters and attenuators for microwave applications in defense and instrumentation, and CX Series, which includes family of ASIC solutions for custom integrated circuit design.
GX Series
The GigOptix GX Series of products services both the telecom and data-com markets with a broad portfolio of drivers and transimpedence amplifiers that address 10Gbps, 40Gbps and 100Gbps speeds over distances that range from 100 meters to 10,000 kilometers. The GX Series devices are used in FiberChannel, Ethernet, synchronous optical networking (SONET)/ synchronous digital hierarchy (SDH) components and those based upon the optical internetworking forum (OIF) standards.
HX Series
The GigOptix HX Series of products service the high performance computing (HPC), data-com and consumer markets with a portfolio of parallel VCSEL drivers and TIAs that address 3Gbps, 5Gbps,10Gbps, 14Gbps, 16Gbps and 25Gbps channel speeds over 100-300 meters distances in four and 12 channel configurations. The HX Series devices are used in HPC formats, Infiniband, Ethernet and optical high definition multimedia interface (HDMI) components.
LX Series
The GigOptix LX Series of products service the 40Gbps and above telecom! market f! or Mach-Zehnder modulators. The LX Series devices are based on the Company's TFPS EO material technology.
EX Series
The GigOptix EX Series of products leverages the high performance products acquired in the Endwave acquisition. In addition, it also includes the die and design techniques developed for the GX Series telecom and data-com drivers for related defense and instrumentation applications.
CX Series
The GigOptix CX Series of products offers a portfolio of distinct paths to digital and analog mixed signal ASICs with the capability of supporting designs of up to 10M gates in technologies ranging from 0.6 through 65nm. The CX Series uses the Company's technology in Structured and Hybrid ASICs to enable a generic ASIC solution that can be customized for a customer using only a few metal mask layers. The CX Series also offers ASIC services, including Analog and Mixed Signal IP into designs and taking customers designs from RTL or gate-level net list definitions to volume production with third party foundries.
The Company competes with TriQuint, Rohm, InPhi, Centellax, Semtech, Vitesse, M/A-Com, Avago, Emcore, Tyco Electronics, IPtronics. Avago, Emcore, Tyco Electronics, JDSU, Oclaro, Sumitomo, Fujitsu, Emcore, Oclaro, Hittite, Sumitomo, Hittite, RFMD, Northrop Grumman, On -Semiconductor, eSilicon, Open Silicon, Faraday, Toshiba and eASIC.
Advisors' Opinion:- [By maarnio]
Lightwave Logic�� main competitor is GigOptix (GIG). GigOptix has designed and patented potentially commercially feasible electro-optic polymers and holds an exclusive license to all electro-optic polymeric technology developed at the University of Washington.
- [By Bryan Murphy]
It's admittedly overbought and due for a slight dip thanks to today's surge. But when you take a step back and look at GigOptix Inc. (NYSEMKT:GIG), there's actually a lot to be excited about if you've been mulling a trading in GIG. The trick will be getting the timing right.
Top 5 Semiconductor Stocks To Buy For 2014: Solitron Devices Inc (SODI)
Solitron Devices, Inc., incorporated on March 12, 1987, designs, develops, manufactures and markets solid-state semiconductor components and related devices primarily for the military and aerospace markets. The Company manufactures a variety of bipolar and metal oxide semiconductor (MOS) power transistors, power and controls hybrids, junction and power MOS field effect transistors (Power MOSFETS), field effect transistors and other related products. It's products are custom made pursuant to contracts with customers whose end products are sold to the United States government. The Company�� semiconductor products can be classified as active electronic components. The Company�� active electronic components include bipolar transistors and MOS transistors.
The Company�� semiconductor products are used as components of military, commercial, and aerospace electronic equipment, such as ground and airborne radar systems, power distribution systems, missiles, missile control systems, and spacecraft. Its products have been used on the space shuttle and on the spacecraft sent to the moon, to Jupiter (on Galileo) and, to Mars (on Global Surveyor and Mars Sojourner).
Power Transistors
The Company manufactures a variety of power bipolar transistors for applications requiring currents in the range of 0.1 ampere to 300 ampere or voltages in the range of 30 volts to 1000 volts. It also manufactures power diodes under the same military specification. In addition, it manufactures power N-Channel and P-Channel MOSFET transistors and is expanding that line in accordance with customers��requirements.
Hybrids
The Company manufactures thick film hybrids, which generally contain discrete semiconductor chips, integrated circuits, chip capacitors and thick film or thin film resistors. The hybrids are of the high-power type and are custom manufactured for military and aerospace systems. Some of the Company�� hybrids include high power voltage regulators, p! ower amplifiers, power drivers, boosters and controllers. The Company manufactures both standard and custom hybrids.
Voltage Regulators
Voltage regulators provide the power required to activate electronic components such as the integrated circuits. These circuits are found in all electronic devices from radar and missile systems to smart phones.
Field Effect Transistors
The Company manufactures about 30 different types of junction and MOS field effect transistor chips. They are used to produce over 350 different field effect transistor types. The Company�� field effect transistors conform to standard Joint Electronic Device Engineering Council designated transistors, commonly referred to as standard 2N number types. It manufactures both standard and custom field effect transistors.
The Competes with IXYS Corporation, Motorola Inc., International Rectifier, Microsemi Corporation, M.S. Kennedy Corporation, Natel Engineering Company and Sensitron Semiconductor.
Advisors' Opinion:- [By Geoff Gannon] on the amount of stock you can buy and the position size you like. For me, I try not to start buying a stock that I think will never make up 10% of my portfolio. If you don�� mind having 5% positions in your portfolio, your portfolio can obviously be twice as big as mine and you can still consider buying the same small stocks I do. In terms of specific stocks, it depends on the amount of float and the volume the stock trades in an average month. We are really getting into specifics here. And I may be boring people. But if you�� like to hear more about the minutiae of how you actually buy and sell tiny stocks like these, let me know, and I��l do an article on the subject.
By the way, there is a hard and fast rule of thumb that it usually makes no sense to invest in a company with a market cap that is smaller than your portfolio. This is true for both fund and individual investors. Funds break it all the time. But, frankly, it is probably a waste of an analyst/fund manager�� time to even analyze such tiny positions relative to the size of the whole portfolio. Since even when we are discussing very small stocks we are still talking about millions and millions of dollars in market cap, this is hardly a concern for most individuals.
So, for individual investors, actual inability to acquire enough shares of a company to meaningful influence their portfolio is rarely the problem. If you bid for a stock month after month ��you��l get your shares.
The concern for individual investors is not whether buying enough shares is possible. The concern is how quickly and easily you can buy and sell. This is what we call ��iquidity.��/p>
Instead of thinking about stocks as liquid or illiquid, you should think in terms of your portfolio and your liquidity needs. It doesn't make much sense to use what I'll call an "objective" (as in stock-oriented) approach to liquidity rather than a "subjective" (as in investor-oriented) approach to liquidity.
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Top 5 Semiconductor Stocks To Buy For 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Alexis Xydias]
The FTSE 100 Index (UKX) gained 53.93 points, or 0.8 percent, to 6,683.93 at 8:58 a.m. in London, rebounding from a 1.4 percent loss yesterday. The benchmark has rallied 13 percent this year as central banks around the world commit to maintain monetary stimulus to nurture economic growth. The broader FTSE All-Share Index (ASX) increased 0.8 percent today, while Ireland�� ISEQ Index advanced 0.5 percent.
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